High-force die bonder has utility in sintering for power semiconductors
The MRSI-705HF high-force die bonder has a heated bond head that applies up to 500 N of force during the bonding process, while providing heating up to 400°C from the top. Applications include sintering for power semiconductors and thermocompression bonding for IC packaging.
MRSI Mycronic
Tewksbury, MA