High-force die bonder has utility in sintering for power semiconductors

    Oct. 17, 2023
    The MRSI-705HF high-force die bonder has a heated bond head that applies up to 500 N of force during the bonding process.
    Mrsi Mycronic 65259c1813702

    The MRSI-705HF high-force die bonder has a heated bond head that applies up to 500 N of force during the bonding process, while providing heating up to 400°C from the top. Applications include sintering for power semiconductors and thermocompression bonding for IC packaging.

    MRSI Mycronic

    Tewksbury, MA

    www.mrsisystems.com

    GET PRICING

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