High-force die bonder has utility in sintering for power semiconductors

Oct. 17, 2023
The MRSI-705HF high-force die bonder has a heated bond head that applies up to 500 N of force during the bonding process.

The MRSI-705HF high-force die bonder has a heated bond head that applies up to 500 N of force during the bonding process, while providing heating up to 400°C from the top. Applications include sintering for power semiconductors and thermocompression bonding for IC packaging.

MRSI Mycronic

Tewksbury, MA

www.mrsisystems.com

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