Holo/Or IR cutting laser enables full-depth glass cutting from single pulse
The DeepCleave module for ultrashort-pulse infrared (IR) laser glass-cutting equipment transforms a Gaussian laser beam into constant peak power along the entire depth of focus, enabling full-depth glass cutting from a single pulse. It can be integrated with existing optomechanics. Typical depth of focus is 1–2 mm with a spot size of <2 µm.
Holo/Or
Ness Zion, Israel