Ion beam trimming system offers subnanometer removal

July 11, 2024
The Trim 200 ion beam trimming system is used for high-precision surface trimming of wafers, without limitations on film and wafer materials.

The Trim 200 ion beam trimming system is used for high-precision surface trimming of wafers, without limitations on film and wafer materials. Film thickness homogeneity can be adjusted to the atom level of 0.1 nm. It offers subnanometer removal with a zero base etch function and no edge exclusion using an electrostatic chuck. 
scia Systems
Chemnitz, Germany
www.scia-systems.com

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