• Ion beam trimming system offers subnanometer removal

    The Trim 200 ion beam trimming system is used for high-precision surface trimming of wafers, without limitations on film and wafer materials.
    July 11, 2024

    The Trim 200 ion beam trimming system is used for high-precision surface trimming of wafers, without limitations on film and wafer materials. Film thickness homogeneity can be adjusted to the atom level of 0.1 nm. It offers subnanometer removal with a zero base etch function and no edge exclusion using an electrostatic chuck. 
    scia Systems
    Chemnitz, Germany
    www.scia-systems.com

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