Ion beam trimming system offers subnanometer removal
The Trim 200 ion beam trimming system is used for high-precision surface trimming of wafers, without limitations on film and wafer materials. Film thickness homogeneity can be adjusted to the atom level of 0.1 nm. It offers subnanometer removal with a zero base etch function and no edge exclusion using an electrostatic chuck.
scia Systems
Chemnitz, Germany
www.scia-systems.com