Laser annealing system features spot scanning
The microPRO XS OCF laser annealing system performs ohmic contact formation in silicon carbide (SiC) power devices. It features a UV diode-pumped solid-state (DPSS) laser source with nanosecond pulses and spot scanning to process the entire metalized backside of SiC wafers up to 200 mm without stitching, while preventing large carbon clusters and heat-related damage to the front side of the wafer.
3D-Micromac
Chemnitz, Germany