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    1. Laser Processing

    Laser annealing system features spot scanning

    Aug. 26, 2023
    The microPRO XS OCF laser annealing system performs ohmic contact formation in silicon carbide (SiC) power devices.
    3 D Micromac 64c11430303c8

    The microPRO XS OCF laser annealing system performs ohmic contact formation in silicon carbide (SiC) power devices. It features a UV diode-pumped solid-state (DPSS) laser source with nanosecond pulses and spot scanning to process the entire metalized backside of SiC wafers up to 200 mm without stitching, while preventing large carbon clusters and heat-related damage to the front side of the wafer.

    3D-Micromac

    Chemnitz, Germany

    www.3d-micromac.com

    GET PRICING

    About the Author

    LFW Staff

    Published since 1965, Laser Focus World—a brand and magazine for engineers, researchers, scientists, and technical professionals—provides comprehensive global coverage of optoelectronic technologies, applications, and markets. With 80,000+ qualified print subscribers in print and over a half-million annual visitors to our online content, we are the go-to source to access decision makers and stay in-the-know.

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