Compound for laser direct structuring of antennas available
LNP THERMOCOMP WF006V compound is used for laser direct structuring (LDS) of antennas that are integrated into the housings and covers of consumer electronics devices, appliances and other electronic components. The glass-fiber-reinforced compound provides a tensile modulus more than 2X higher than that of unfilled polybutylene terephthalate (PBT) or polycarbonate (PC) resin.
SABIC
Riyadh, Saudi Arabia