Waterjet-guided laser cutting systems maker Synova (Duillier, Switzerland) has opened a Micro-Machining Center (MMC) in Mumbai, India. The new micromachining facility will allow the company to better serve existing local customers and to meet the growing market demand in the area.
Related: Synova relocates North American laser micromachining center to New Jersey
The MMC offers laser sawing jobs such as straight sawing, pie sawing, and fancy bruting of gem diamonds, as well as stone analyses and machine demonstrations. The center is equipped with one of the company's laser diamond cutting systems with its Laser MicroJet (LMJ) technology, and is run by a group of experienced operators, analyzers, and gluing professionals from the company's MMC in Surat, India.
The company's LMJ technology combines a laser beam with a low-pressure water jet, which cools the cutting zone, removes debris, and offers parallel kerfs. The technology enables maximum precision and minimum waste in diamond cutting, reducing damage to expensive rough stones and providing higher yields.
For more information, please visit www.synova.ch.
