Selective laser annealing system

June 29, 2018
The microPRO RTP laser annealing system combines a laser optic module with a modular semiconductor wafer processing platform.

The microPRO RTP laser annealing system from 3D-Micromac (Chemnitz, Germany) combines a laser optic module with the company's modular semiconductor wafer processing platform to provide selective annealing with high repeatability and throughput. Features include a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional laser wavelengths (near-infrared, green, and ultraviolet). The system addresses a variety of applications, including semiconductor, power device, and MEMS manufacturing.

For more information, please visit www.3d-micromac.com.

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Industrial Laser Solutions Editors

We edited the content of this article, which was contributed by outside sources, to fit our style and substance requirements. (Editors Note: Industrial Laser Solutions has folded as a brand and is now part of Laser Focus World, effective in 2022.)

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