Tekcore chooses JPSA laser scribing systems

July 18, 2007
July 18--J P Sercel Associates announced the sale of two IX-210 ChromaDice wafer scribing systems and an IX-260 ChromaLift LLO system to Tekcore

July 18----J P Sercel Associates (JPSA) has announced the sale of two IX-210 ChromaDice wafer scribing systems and an IX-260 ChromaLift LLO (LED Lift-Off) system to Taiwan's Tekcore Co. Ltd., a supplier of high-brightness LED wafers and chips.

Mr. Nithi M. Nithipalan, president and CEO of Tekcore, said, "We chose JPSA laser systems because JPSA is the recognized market leader in front-size scribing technology. It is important to us to maintain our global leadership position and to provide the best possible product to our customers worldwide. JPSA equipment helps us to do this, with systems that produce more die per wafer and industry leading throughput."

The JPSA IX-210 ChromaDice is a UV laser workstation equipped with a diode-pumped solid-state laser and is a Class 1 industrial grade system designed for high-volume wafer singulation. The UV laser singulation process is a fast, low-stress method of singulation that minimizes chip breakage after cutting, for high yields, with kerfs as narrow as 2.5 microns, and generates minimal debris. The UV singulation process is vibration-free, unlike mechanical processing, which can cause chipping and micro-cracking of the wafer, resulting in unacceptable cut quality and poor die-edge fracture strength.

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