Laser microvia process released to production

Feb. 17, 2010
Murrysville, PA—As finished products become smaller and lighter weight and with new component packages shrinking in size, circuit density is steadily increasing. Microvia technology helps designers fit more connections in less space.

Murrysville, PA—As finished products become smaller and lighter weight and with new component packages shrinking in size, circuit density is steadily increasing. Microvia technology helps designers fit more connections in less space. In keeping up with the ever-shrinking real estate on flexible and rigid flex PCB designs, Circuits, LLC has released a microvia processes from engineering development to production.

Flex boards lend themselves particularly well to high-density interconnect technology because microvias, typically connecting one layer of the PCB to the next, can be manufactured with reasonably high yields thanks to thin dielectrics and glass-free materials. Circuits, LLC employs controlled depth laser drilling in combination with finely tuned plasma etchback and plating parameters to achieve the most reliable finished holes.

According to Don Anderson, Circuits’ quality assurance manager, “Quality is something we build into our products as a result of our upfront design for manufacturability review, our firm process controls and the strength of our Quality Management System (QMS).” Anderson adds that “through-hole interconnect integrity and plating thicknesses are verified through daily cross-sectioning at Circuits.”

Circuits, LLC (www.qualityacrosstheboard.com) is a quality‐driven, customer‐focused manufacturer of highly reliable built‐to‐spec flexible printed circuit boards serving the defense, industrial, and medical markets with consistent quality and on‐time delivery.

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