Transforming laser marking and machining with new patent

Nov. 8, 2010
Rochester, N.Y. – (Exclusive to Industrial Laser Solutions) Radian Laser Systems announces the filing of a patent by Chief Scientist Wayne Shaffer that the company expects will transform the technology of laser marking and engraving of metals and certain other materials.

Rochester, N.Y. – (Exclusive to Industrial Laser Solutions)Radian Laser Systems announces the filing of a patent by Chief Scientist Wayne Shaffer that the company expects will transform the technology of laser marking and engraving of metals and certain other materials.

According to Shaffer, this patent-pending process technology fundamentally alters the nature of the interaction of the laser beam with the material and increases the effective energy by a factor of 2 to 5 times, as measured by material removal, with no corresponding increase in power.

The implications of this are immediately obvious. For example, a 10-watt laser utilizing this technology would have the effective power and throughput of a laser operating at 20 to 50 watts.

Radian is currently in discussions with potential strategic partners about cooperating in exploiting this technology more broadly. Radian will be exhibiting this technology at Laser World of Photonics in Munich in May 2011.

A video showing the process improvement can be found on the company's website, http://www.radianlaser.com/newsite/technology.html.

For more information, email: [email protected]

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