LPKF introduces ProtoLaser U3 multipurpose UV laser processing system

LPKF Laser & Electronics,Tualatin, OR, has introduced the ProtoLaser U3 laser, a small UV laser system that can be used in a wide breadth of applications and process a wide variety of material substrates.

From cutting/depaneling any material from flex to fired ceramics, to drilling, skiving, decaping and direct surface metal etching of the artwork, the ProtoLaser U3 system has the ability to process applications for product development that previously were possible only with the help of large, expensive industrial systems.

The ProtoLaser U3 combines the capabilities of the previous generation ProtoLaser U (UV laser) and ProtoLaser S (IR laser) models into one multipurpose system. Not only does it have the ability to cut or depanel nearly any substrate material, its additional functionality allows for drilling, marking, depth engraving and surface etching of circuitry directly onto FR4, ceramic or any other high-frequency RF substrate. The 15 μm beam spot allows for etching surface structures down to as small as 1 mil.

Good for applications that require highly precise geometry and repeat accuracy, the ProtoLaser U3 can quickly process applications and switch between projects hassle-free, offering maximum flexibility. The high pulse energy of the UV laser eliminates residue and tooling costs, and is a chemical free process. Due to its versatile capabilities, the ProtoLaser can structure laminated substrates.