Laser Services expands microelectronics work with new CO2 laser
April 27, 2012
Laser Services, a laser job shop in Westford, MA, has added a new microscope-aligned CO2 laser to widen its laser cutting capabilities for substrates and printed circuit boards (PCB). The company, which also recently hired new staff, now has four such lasers in daily operation, enabling quicker order turns and shorter lead times.
With these microscope-aligned lasers, the firm can cut ceramic substrates up to 0.12 in thick, and cut or drill with 0.00025 in (6.35 μm) tolerance from feature to feature. The company commonly processes materials include metallized substrates, silicon carbide (SiC), silicon wafers, Al2O3 alumina, Duroid (a laminate used in circuit boards), and individual circuits and PCBs.
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