Is this new "intelligent packaging" a threat to laser marking?

Does this describe a disruptive technology that might impact the market growth for laser marking of packages? Suppliers of laser systems serving the packaging industry should take note. -- David A. Belforte

Flexible packaging materials supplier Bemis Co. and printed electronics firm Thin Film Electronics ASA have agreed to accelerate development and commercialization of an "Intelligent Packaging Platform," incorporating sensor labels made with Thin Film's printed electronic technology (proprietary printed memory/logic) and Bemis' packaging. The combined "intelligent labels" will be capable of monitoring and recording key physical properties and environmental data in packaged perishable products. Commercial availability is expected in 2014.

"Intelligent packaging is an emerging technology with many potential intersections with Bemis' flexible packaging and pressure sensitive materials business segments," stated company president/CEO Henry Theisen. The technology "could eventually make printed electronics a component of every package we manufacture."

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