IMRA and Disco to jointly develop laser dicing

March 20, 2012
Joint venture will develop laser dicing equipment.

Ann Arbor, MI - IMRA America, Inc., a subsidiary of Aisin Seiki Co., Ltd., and Disco Corporation ( www.disco.co.jp) have agreed to collaborate in the development of new lasers and processing systems for laser dicing of semiconductor materials.

IMRA America (www.imra.com) has supplied several hundred femtosecond fiber lasers that are now being used in semiconductor manufacturing facilities, delivering the high reliability and stability required for 24/7 operation. Also, IMRA America is the exclusive licensee of US Patent 5,656,186 by the University of Michigan, essential for femtosecond and picosecond laser materials processing, which they license to their customers.

In the future, both companies will together provide new solutions utilizing the unique capabilities of femtosecond lasers, which minimize thermal effects in materials processing.

For more information contact [email protected].

Sponsored Recommendations

March 31, 2025
Enhance your remote sensing capabilities with Chroma's precision-engineered optical filters, designed for applications such as environmental monitoring, geospatial mapping, and...
March 31, 2025
Designed for compatibility with a wide range of systems, Chroma's UV filters are engineered to feature high transmission, superior out-of-band blocking, steep edge transitions...
March 31, 2025
Discover strategies to balance component performance and system design, reducing development time and costs while maximizing efficiency.
March 31, 2025
Filter accessories including cubes, sliders, and rings, designed to enhance the performance and versatility of optical systems. These components ensure precise alignment and stability...

Voice your opinion!

To join the conversation, and become an exclusive member of Laser Focus World, create an account today!