Laser material processing platform

Sept. 24, 2014
Universal Laser Systems has released its XLS10MWH Multiwave Hybrid laser material processing platform, which combines the laser energies of a 9.3 or 10.6 µm CO2 laser and a 1.06 µm fiber laser into a single beam.

Scottsdale, AZ - Universal Laser Systems has released its XLS10MWH Multiwave Hybrid laser material processing platform, which combines the laser energies of a 9.3 or 10.6 µm CO2 laser and a 1.06 µm fiber laser into a single beam. By allowing laser configurations of multiple wavelengths, the technology enables cutting and marking/engraving of both organic and inorganic materials. Control of lasers individually or simultaneously provides unlimited laser energy combinations for advanced material processing of aerospace, automotive, electronic, and other engineered materials, including reinforced polymers, composites, nanocomposites, and hybrid materials.

For more information, please visit www.ulsinc.com.

About the Author

Industrial Laser Solutions Editors

We edited the content of this article, which was contributed by outside sources, to fit our style and substance requirements. (Editors Note: Industrial Laser Solutions has folded as a brand and is now part of Laser Focus World, effective in 2022.)

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