Laser material processing platform

Scottsdale, AZ - Universal Laser Systems has released its XLS10MWH Multiwave Hybrid laser material processing platform, which combines the laser energies of a 9.3 or 10.6 µm CO₂ laser and a 1.06 µm fiber laser into a single beam. By allowing laser configurations of multiple wavelengths, the technology enables cutting and marking/engraving of both organic and inorganic materials. Control of lasers individually or simultaneously provides unlimited laser energy combinations for advanced material processing of aerospace, automotive, electronic, and other engineered materials, including reinforced polymers, composites, nanocomposites, and hybrid materials.

For more information, please visit www.ulsinc.com.