Picosecond laser for micromachining

Jan. 20, 2014
Fianium’s HYLASE-25 picosecond laser for micromachining is available for customer trials and will be shown at SPIE Photonics West 2014.

Southampton, UK – Fianium has released the HYLASE-25, a newly developed high-energy picosecond laser, for customer trials. The HYLASE systems consist of two models, with sub-20 picosecond pulse duration and specified power (maximum pulse energy) of 8W (50 uJ) and 25W (125 uJ). The Hylase laser and results and samples of ultrafast processing will be shown in Booth # 729 at the SPIE Photonics West exhibition.

With built-in optical modulators, HYLASE offers flexible pulse repetition rate up to 40MHz and burst-mode operation for advanced process development. Both models have also second harmonic module as an option. The Hylase lasers also have a compact footprint, reportedly smaller than all other picosecond lasers of this class.

“The parameters of HYLASE make the ultra-compact, economical systems ideally suited for efficient, high speed, non-thermal, precision micromachining of semiconductors, dielectrics, metals, and polymer materials,” explalins John Clowes, VP of Business Development explains. “Numerous material tests have now been conducted for a variety of customers, in two key locations, Summit Photonics (Portland, OR) and Laser Zentrum Hannover (Germany), both well known for extensive experience in ultrafast laser micromachining. We are extremely pleased with feedback from our customers and are currently in process of ramping up Hylase production to make lasers available for customer trials.”






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