Laser processing for microchip failure analysis

Control Systemation (Orlando, FL) offers a patented laser processing method for failure analysis for challenging microchip applications. The FALIT is a specialized laser system designed for precise material removal without damage to components such as wires and bonds. New high-temperature compounds, smaller wires and bonds, copper, new fillers impervious to chemicals, and smaller sizes are challenges that FALIT reportedly overcomes.

The system facilitates microchip decapsulation, exposing wire bonds without damage, cross sectioning devices, component delidding, and making your own acid gaskets.