Laser scribing solar cells

Dec. 11, 2008
A proprietary technique from J.P. Sercel Associates enables high-throughput edge isolation of silicon wafer solar cells

J. P. Sercel Associates Inc. (JPSA), a provider of laser scribing systems for solar cell processing applications, announces the advancement of a new proprietary technique for high-throughput edge isolation of silicon (Si) wafer solar cells.

This highly efficient laser scribing technique called 'SuperScribe™', produces narrow and precise cuts in Si solar wafers. JPSA has achieved a variable width of 30µm and a depth of 16 µm with high-throughput isolation cuts at rates up to 300mm per second with no recast, and offers fully integrated debris control via JPSA's vortex debris control tool. This micro precision scribing technique produces a higher quality product than what is currently available today.

When integrated with high-speed motion stages, this scribing technique produces even faster cuts and significantly increases production capabilities by providing a cost effective advantage.

JPSA has also accomplished 300mm per second scribe speeds for trimming or modifying the dimensions of standard Si Solar wafers.

In announcing the 'SuperScribe™' technology, Chairman & CTO Jeff Sercel, said, "JPSA has long been in the forefront of advancing 'green' technology with the development of new processes in solar scribing. JPSA's most recent development allows us to offer our solar customers scribe speeds at 300mm per second, and minimize debris due to proprietary beam delivery optics and optimized process control. With this new capability JPSA is able to offer a higher quality service and product that will ramp up production, and be more cost-effective for our current and future customers."

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