ESI releases 5390 micromachining system for advanced LED packaging

    July 13, 2011
    ESI Inc., Portland Ore., has released the Model 5390 micromachining system for advanced LED packaging. This system is designed for creation of electrical interconnections on LED packages and is optimized for via placement accuracy and high yields.

    ESI Inc., Portland Ore., has released the Model 5390 micromachining system for advanced LED packaging. This system is designed for creation of electrical interconnections on LED packages and is optimized for via placement accuracy and high yields.

    "Our customers are demanding new, innovative manufacturing processes that enable them to enhance light output and product reliability on smaller and smaller LED packages," said Martin Orrick, senior director in ESI's Interconnect and Micromachining Group. "Our Model 5390 enables the industry's fastest and highest via placement accuracy."

    Featuring ESI's production-proven, high-speed compound beam positioner coupled with a high-power CO2 laser, the Model 5390 provides user-definable variable pulse width and pulse repetition frequencies of up to 300 kHz for wide range of applications. The system can produce more than 100 vias per second in typical single layer dielectric materials. The company shipped the first unit to a leading LED manufacturer in the last quarter.

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