OpTek Systems debuts LaserCleave benchtop laser processing tool

OpTek Systems, Greenville, S.C., has debuted its LaserCleave^TM benchtop laser tool at the OFC/NFOEC-2011 show in Los Angeles. It is a compact production tool designed to maximize productivity in optical connector and component manufacturing.

Central to the LaserCleave technology’s core value is the elimination of mechanical scribing, which is prone to fiber chips and hackle, and the reduction of polishing steps required for GR-326 (Telcordia) compliance. “By eliminating operator variability in scribing, coupled with the dramatic savings in consumable and labor costs, we believe this technology will have a very positive impact on global manufacturing,” states Andrew Webb, director of business development, OpTek Systems.

The LaserCleave platform consists of tools for cleaving simplex connectors, bare fibers, and multi-fiber connectors, including ribbon fiber. “With the rapid evolution of short reach and active optical interconnectivity, combined with continued pressures on factory costs, market conditions definitely favor next generation manufacturing platforms,” says Duane Dinkel, president, OpTek Systems.