Laser marking system for 450 mm wafers

InnoLas Semiconductor has installed and successfully commissioned its second laser marking system for 450 mm wafers. The "bridge tool" marks 450 mm wafers as well as 300 mm silicon wafers on either side and then it checks the quality of the result automatically.

Wafers with a diameter of 450 mm give the microchip industry an increase in yield of up to 80 percent. This leads to an enormous increase in productivity. In order to control the product quality, these wafers need to receive a specific marking from the manufacturer.

As an optional bridge-tool variant, the laser marking system can mark 450 mm and 300 mm wafers on either side. The system checks the result automatically and thus reduces the process operations significantly. According to requirements, the customer can choose between vacuum handling and edge-grip handling. The latter transports the wafers especially carefully and cleanly.

Innolas places particular emphasis on in-house developments and products in the application of high-precision components. Together with the robust further development of proven engineering, this ensures a constant high quality standard in marking and handling processes, also for the new wafer sizes.

"The marking and handling quality will be maintained at our high level for the new wafer sizes. To achieve this, we use components developed in-house whenever the requirements are of high precision. These are otherwise not available in suitable quality as required by us and our customers," explains Andreas Behr, GM of InnoLas Semiconductor GmbH.