ESI joins Georgia Institute of Technology 3D Systems Packaging Research Center

May 30, 2016
Laser drilling system maker ESI has joined the Georgia Institute of Technology 3D Systems Packaging Research Center as a full member.

Electro Scientific Industries (ESI; Portland, OR) has joined the Georgia Institute of Technology 3D Systems Packaging Research Center (PRC; Atlanta, GA) as a full member. As part of the partnership, ESI has installed a CornerStone ICP UV laser drilling system at the center to further enable on-campus R&D into via formation for future redistribution layers (RDLs) used in microelectronics.

The CornerStone ICP system is a good fit for the center's research into the most demanding next-generation applications. "Working with the ESI team, 8- to 10µm-diameter vias at 20µm pitch for multilayer RDL have already been demonstrated on glass interposers," comments Dr. Venky Sundaram, PRC associate director for industry programs. Prof. Rao Tummala, center director of PRC, adds, "This technology is a key part of the consumer-driven, high-performance, and automotive applications that we are pursuing." And Michael Darwin, general manager of the Industrial Products Division at ESI, states that "As the semiconductor and associated packaging technology moves to next-generation substrates in support of new products and industries, the requirements for size, shape, accuracy, and precision have become increasingly demanding."

PRC is a center for applied research into IC packaging technologies and best practices. With its industry partners, it is pioneering research into glass packaging as the next platform beyond organic packaging, and demonstrated the first prototypes of high-density glass substrates in 2013. This technology is being commercialized by several partners in Taiwan and Japan, while the center is focusing on continued research into the next-generation of 2.5D and 3D interposers, targeted to use ultra-fine interconnect pitches down to 20µm.

Laser systems are widely employed for drilling vias in organic substrates used for IC packages, with via dimensions in leading-edge substrates around 40-50µm in diameter. The Georgia Tech PRC-ESI co-development program will include research into combining the superior dimensional stability of glass substrates with the small via and high-accuracy capabilities of the CornerStone ICP system, demonstrating on large panels the very fine pitch sizes that are currently only possible using silicon interposers.

For more information, please visit www.esi.com.

Sponsored Recommendations

Request a free Micro 3D Printed sample part

April 11, 2024
The best way to understand the part quality we can achieve is by seeing it first-hand. Request a free 3D printed high-precision sample part.

How to Tune Servo Systems: The Basics

April 10, 2024
Learn how to tune a servo system using frequency-based tools to meet system specifications by watching our webinar!

Motion Scan and Data Collection Methods for Electro-Optic System Testing

April 10, 2024
Learn how different scanning patterns and approaches can be used in measuring an electro-optic sensor performance, by reading our whitepaper here!

How Precision Motion Systems are Shaping the Future of Semiconductor Manufacturing

March 28, 2024
This article highlights the pivotal role precision motion systems play in supporting the latest semiconductor manufacturing trends.

Voice your opinion!

To join the conversation, and become an exclusive member of Laser Focus World, create an account today!