U.S. chipmaker qualifies Synova LDS 200 for production-level dicing of GaAs wafers

    Dec. 5, 2005
    December 5--Adoption of Synova tool for compound semiconductor applications illustrates growing popularity of laser microjet technology.

    December 5--Synova today announced that, following several months of test runs and qualification, its LDS 200 A laser dicer has now entered full production at a major U.S. chip manufacturer's facility. The customer, a leading maker of compound semiconductors, acquired the Synova Laser MicroJet-based system earlier this year and is using the tool for dicing wafers containing gallium arsenide (GaAs)-based ICs.

    According to Synova, the customer adopted the LDS 200 A for its speed, cleanliness, absence of chipping or cracking, small kerfs, and ability to minimize environmental issues.

    Synova will be exhibiting at SEMICON Japan, December 7-9, 2005, at Makuhari Messe, Chiba.

    For more information, visit www.synova.ch.

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