Laser trimming systems ordered

Feb. 1, 2004
Billerica, MA—Things have been rather slow in the semiconductor industry for the past two years so it was exceptionally good news to learn of a large order for production equipment placed with GSI Lumonics for multiple WaferTrim.

Billerica, MA—Things have been rather slow in the semiconductor industry for the past two years so it was exceptionally good news to learn of a large order for production equipment placed with GSI Lumonics for multiple WaferTrim. M310 systems by a leading U.S.-based integrated circuit manufacturer. This order, valued at about $6 million, will be delivered in the first quarter. A similar order was placed in December last year.

Laser trimming is a critical procedure in the production of precision linear and mixed signal devices as functionality is increased on smaller geometry dies, because it allows multiple dies to be produced from the same die.

Nino Federico, GSI Lumonics vice president and general manager of the laser system division, says, "Recent strong demand from a variety of markets, including automotive and for new consumer electronic devices, has translated into a need for precise, reliable laser trim." With more than a decade of experience, GSI Lumonics (www.gsilumonics.com) is the principal global supplier of wafer-level trim systems to the IC industry.

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