Alexander C.A.J. Dorrestein

Alexander (Sander) C.A.J. Dorrestein is the program manager of Integrated Photonics at the Chip Integration Technology Center (CITC; Nijmegen, Netherlands).

(Image credit: RJR Technologies)
Optics

Photonic integrated circuit packaging prototype moves to testing

July 17, 2024
A low-cost alternative to the existing hermetic butterfly-style package, an air-cavity liquid crystal polymer (LCP) package, can replace traditional hermetic butterfly packages...