Ashwini Tamhankar

Senior Applications Engineer, MKS Spectra-Physics

Ashwini Tamhankar was senior applications engineer at MKS Spectra-Physics (Milpitas, CA) from 2007 through 2014.

FIGURE 1. Scribe depth vs. speed for silicon, illustrating the process optimization benefit possible using TimeShift technology.
FIGURE 1. Scribe depth vs. speed for silicon, illustrating the process optimization benefit possible using TimeShift technology.
FIGURE 1. Scribe depth vs. speed for silicon, illustrating the process optimization benefit possible using TimeShift technology.
FIGURE 1. Scribe depth vs. speed for silicon, illustrating the process optimization benefit possible using TimeShift technology.
FIGURE 1. Scribe depth vs. speed for silicon, illustrating the process optimization benefit possible using TimeShift technology.
Industrial Laser Solutions

UV lasers fuel precision micromachining

Nov. 6, 2014
High power, short pulse width, and higher repetition rate yield higher speed and quality.
FIGURE 1. ABF surface view (a) and copper substrate view (b) of ~60-μm-diameter PCB blind vias in GX series buildup film. Optimized process with short-nanosecond pulses leaves copper surface suitable for plating.
FIGURE 1. ABF surface view (a) and copper substrate view (b) of ~60-μm-diameter PCB blind vias in GX series buildup film. Optimized process with short-nanosecond pulses leaves copper surface suitable for plating.
FIGURE 1. ABF surface view (a) and copper substrate view (b) of ~60-μm-diameter PCB blind vias in GX series buildup film. Optimized process with short-nanosecond pulses leaves copper surface suitable for plating.
FIGURE 1. ABF surface view (a) and copper substrate view (b) of ~60-μm-diameter PCB blind vias in GX series buildup film. Optimized process with short-nanosecond pulses leaves copper surface suitable for plating.
FIGURE 1. ABF surface view (a) and copper substrate view (b) of ~60-μm-diameter PCB blind vias in GX series buildup film. Optimized process with short-nanosecond pulses leaves copper surface suitable for plating.
Lasers & Sources

ULTRAVIOLET LASERS: UV lasers improve PCB manufacturing processes

Nov. 1, 2012
The trend in PCB design toward smaller features at higher densities is essential to support the fast-growing market for high-tech consumer products, and in turn requires new laser...
FIGURE 1. Plot of scribe speed as a function of laser fluence at 100 kHz PRF for scribing 30 μm deep scribe in alumina ceramic.
FIGURE 1. Plot of scribe speed as a function of laser fluence at 100 kHz PRF for scribing 30 μm deep scribe in alumina ceramic.
FIGURE 1. Plot of scribe speed as a function of laser fluence at 100 kHz PRF for scribing 30 μm deep scribe in alumina ceramic.
FIGURE 1. Plot of scribe speed as a function of laser fluence at 100 kHz PRF for scribing 30 μm deep scribe in alumina ceramic.
FIGURE 1. Plot of scribe speed as a function of laser fluence at 100 kHz PRF for scribing 30 μm deep scribe in alumina ceramic.
Industrial Laser Solutions

High-quality, high-speed micromachining with short pulse lasers

Sept. 1, 2012
Techniques to manage the high energy and high PRF available from today's Q-switched DPSS lasers.