• Ashwini Tamhankar

    Senior Applications Engineer, MKS Spectra-Physics

    Ashwini Tamhankar was senior applications engineer at MKS Spectra-Physics (Milpitas, CA) from 2007 through 2014.

    FIGURE 1. Scribe depth vs. speed for silicon, illustrating the process optimization benefit possible using TimeShift technology.
    Rajesh Patel
    Nov. 6, 2014
    High power, short pulse width, and higher repetition rate yield higher speed and quality.
    FIGURE 1. ABF surface view (a) and copper substrate view (b) of ~60-μm-diameter PCB blind vias in GX series buildup film. Optimized process with short-nanosecond pulses leaves copper surface suitable for plating.
    Jim Bovatsek
    Nov. 1, 2012
    The trend in PCB design toward smaller features at higher densities is essential to support the fast-growing market for high-tech consumer products, and in turn requires new laser...
    FIGURE 1. Plot of scribe speed as a function of laser fluence at 100 kHz PRF for scribing 30 μm deep scribe in alumina ceramic.
    Jim Bovatsek
    Sept. 1, 2012
    Techniques to manage the high energy and high PRF available from today's Q-switched DPSS lasers.