Encapsulant from Intertronics requires no mixing

July 20, 2010
The Dymax Multi-Cure 9001-E Series of encapsulants cures in as little as 5 s to provide moisture and abrasion resistance and thermal cycle performance of electronic and microelectronic assemblies.

The Dymax Multi-Cure 9001-E Series of encapsulants cures in as little as 5 s to provide moisture and abrasion resistance and thermal cycle performance of electronic and microelectronic assemblies. They cure fast under longwave UV and visible light and require no mixing. Viscosities from 400 to 50,000 cP provide coverage over various geometries.
Intertronics
Kidlington, Oxfordshire, England
[email protected]

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PRESS RELEASE

NEW PRODUCT

FAST CURE, NO MIXING, SUPERIOR PERFORMANCE ENCAPSULANT FROM INTERTRONICS

Intertronics’ latest introduction to the world of electronic encapsulants is the Multi-Cure® 9001-E series which addresses the age old problems of time and mess/mixing with consummate success. This DYMAX Multi-Cure® 9001-E Series of encapsulants cure in as little as 5 seconds to provide superior moisture and abrasion resistance and thermal cycle performance of electronic and microelectronic assemblies. The fast cure on exposure to long wave UV and visible light minimizes processing and energy costs associated with alternative technologies that require mixing or elevated temperatures for curing. The 9001-E materials are all one part, so no mixing is required and consistent viscosity is maintained – in addition various viscosities are available from 400cP to 50,000cP to provide optimal coverage over various geometries.

Multi-Cure 9001-E series materials have high ionic purity, are solvent free, and isocyanate free. They have been engineered to have a low modulus to minimize stress on delicate wire bonds. When exposed to UV/visible light they will cure in seconds, while any shadowed areas will cure upon heat exposure. To prevent damage of fine wires, these encapsulants contain no sharp, abrasive mineral or glass fillers. They may be dispensed from a variety of automatic bench-top syringe applicators or other equipment and require only relatively low cost light sources to instigate the curing process.

Multi-Cure 9001-E Series encapsulants display excellent adhesion to polyimide, PET, flexible printed circuits, FR4 and ceramic boards, and provide superior protection for glob top and COB (chip on board) applications. They are ideal for encapsulating ICs on flex circuits, also for multi-chip modules. Further information regarding Intertronics’ products can be found at www.intertronics.co.uk.

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