Thermal conductivity adhesive from Lord works as a solder replacement

MT-815 is a low-modulus, high-thermal-conductivity adhesive. It has a modulus of <1 GPa, allowing it to be more flexible and less likely to crack or delaminate under the stresses of temperature cycles. Formulated to achieve thermal conductivity of >10 W/m-K, it can be used as a thermal adhesive for large die, in die attach applications, or as a solder replacement.Lord
Cary, NC[email protected]

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PRESS RELEASE

LORD CORPORATION DEVELOPS THERMAL CONDUCTIVITY ADHESIVE

(Cary, NC – May 11, 2010) LORD Corporation ¾ a leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries ¾ has announced the availability of a new low modulus, high thermal conductivity adhesive.

Created in response to a market need for a more flexible, high thermal conductivity adhesive, MT-815 can be used in a variety of applications including as a thermal adhesive for large die, in die attach applications, or as a solder replacement. The first in a series of new low modulus, thermal conductivity adhesives from LORD Corporation, MT-815 has a modulus of <1 GPa , allowing it to be more flexible and therefore less likely to crack or delaminate under the stresses of temperature cycles. MT-815 was also formulated to achieve thermal conductivity of >10 W/m-K, creating a new class of flexible adhesives with high thermal conductivity.

According to Sara Paisner, Staff Scientist for Thermal Management Technology at LORD Corporation, MT-815 builds on a long tradition of innovation in thermal management materials, including GeleaseTM thermal conductive gels, as well as high performance thermal conductivity adhesives like MT-315 and TC-501 no pump-out grease.

“Most thermal adhesives are either flexible with low thermal conductivity (i.e. silicones) or highly rigid with higher adhesion (epoxies). As a result, their uses are limited in microelectronic packages,” said Paisner. “However, this thermal conductive adhesive combines the advantages of high adhesion and thermal conductivity with the need for lower modulus to accommodate the large stresses experienced by electronic packages.”

“LORD is responding to interest from customers who require a low modulus, thermal adhesive to accommodate higher stresses from larger die sizes but cannot sacrifice thermal conductivity,” said Adam Conklin, LORD Global Market Manager – Electronic Materials.

More information on LORD MT-815 can be found at http://www.lord.com/electronics. Additional information can be obtained by contacting LORD Corporation by e-mail at [email protected] or by phone at (877) ASK-LORD.

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Posted by Lee Mather

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