Intertronics adhesive offers zero movement before cure

March 22, 2011
The 9422-SC adhesive is engineered to hold critical components such as ball grid arrays (BGA) and video graphics arrays (VGA) for secondary processes or for long-term reliability.

The 9422-SC adhesive is engineered to hold critical components such as ball grid arrays (BGA) and video graphics arrays (VGA) for secondary processes or for long-term reliability. It features a bead shape designed to wet both the board surface and the component edge without seeping into shadowed areas, offers zero movement prior to cure, is halogen and silicone free, and is RoHS compliant.
Intertronics
Oxfordshire, England

www.intertronics.co.uk

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PRESS RELEASE

LEADLESS COMPONENT RUGGEDISATION WITH NEXT GENERATION ADHESIVES FROM INTERTRONICS

With a particular focus toward harsh duty electronics, the specialists at Intertronics have recently introduced the next generation of fast room-temperature-cure electronics adhesives from sales partner DYMAX. Their new 9422-SC is a component ruggedising and staking material, engineered to hold critical components such as Ball Grid Arrays (BGA) and Video Graphics Arrays (VGA) for secondary processes or for long-term reliability.

DYMAX 9422-SC adhesive is engineered specifically for bonding of critical high value electronic components, ensuring that they stay exactly in place on printed circuit boards throughout manufacture, assembly qualification and service/operation for the full product lifecycle.

Peter Swanson, MD of Intertronics, explains “DYMAX 9422-SC features a bead shape designed to wet both the board surface and the component edge without seeping into shadowed areas and is highly thixotropic for zero movement prior to cure, as well as being halogen and silicone free and RoHS compliant.” Further information regarding Intertronics’ products can be found at www.intertronics.co.uk.

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