Palomar Technologies (Vista, CA), which manufactures automated wire and die bonding equipment, has designed and integrated a complete automated line for the production of optoelectronic packages. Depending on the package design and requirements, the line can integrate wire bonders with the firm's new In-Situ UV Component Assembly Cell, which is designed to avoid problems inherent with snap cure methods such as out gassing, very small batch sizes, and short work times.
The Palomar line is integrated with a high-volume fluid dispenser, reflow oven, plasma cleaner, and inspection machines. Handling between process stations also is automated. For more details, visit www.palomartechnologies.com or contact sales at sales @bonders.com.