Optoscribe and Sumitomo Electric reveal collaboration to deliver multicore fiber components

Feb. 21, 2019
Optoscribe's laser-written glass 3D integrated photonic technology will combine with Sumitomo's multicore fibers.
Wafer-scale fabrication of fiber fan-out. (Image: Optoscribe)Optoscribe (Livingston, UK), which supplies 3D glass-based integrated photonics components, and Sumitomo Electric Industries (Osaka, Japan), which produces optical fiber cable and component manufacturing technology supplier, have announced the formation of a strategic cooperation to provide multicore fiber (MCF) components for datacom and telecom applications. Optoscribe's 3D glass-based photonic integrated circuits combine embedded waveguides and high precision micromachining for applications ranging from data-center optical transceiver interconnects, to fiber connectivity and consumer electronics. This strategic cooperation will seed the market for practical use cases of Sumitomo Electric's MCF interconnects. This is especially true for four core (or greater) MCF with fan-in/fan-out components based on 3D glass-based photonic technology in datacom applications where ultrahigh-density optical interconnection is required. "We see this as a great opportunity to jointly address the performance challenges faced by datacom and telecom applications, while creating and fostering the supply chain for further deployment of multicore fiber and related technologies," says Nick Psaila, Optoscribe's CEO. Optoscribe, formed in 2010, has developed laser direct-write technology to manufacture glass-based integrated 3D photonic components for the telecommunications and data communications markets. For more info on both companies, see:https://global-sei.com/fiber_optic_interconnect/https://www.optoscribe.com Source: Optoscribe

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