Optoelectronic packages

Resistance microwelding techniques provide packaging for fiberoptic connectors, detectors, and other sources. Compared to epoxy packages, microwelding produces mechanically stronger and thermally more stable devices for optoelectronic applications.

Feb 1st, 1995

Resistance microwelding techniques provide packaging for fiberoptic connectors, detectors, and other sources. Compared to epoxy packages, microwelding produces mechanically stronger and thermally more stable devices for optoelectronic applications.

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