Optoelectronic packages

    Feb. 1, 1995
    Resistance microwelding techniques provide packaging for fiberoptic connectors, detectors, and other sources. Compared to epoxy packages, microwelding produces mechanically stronger and thermally more stable devices for optoelectronic applications.

    Resistance microwelding techniques provide packaging for fiberoptic connectors, detectors, and other sources. Compared to epoxy packages, microwelding produces mechanically stronger and thermally more stable devices for optoelectronic applications.

    Standby power supply

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