• Vion™ Plasma FIB

    Oct. 2, 2012
    Enable high-speed cross-sectioning and faster material removal for failure analysis in advanced IC packaging applications.

    Request More Information

    By clicking above, I agree to Endeavor Business Media's Terms of Service and consent to receive promotional communications from Endeavor, its affiliates, and partners per its Privacy Notice. I also understand my personal information will be shared with the sponsor of this content, who may contact me about their offerings per their privacy policy. I can unsubscribe anytime.