High Temperature Resistant, One Component Epoxy Cures at 200-220°F

Oct. 13, 2015

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. Cures can be accelerated at higher temperatures. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates in the aerospace, electronic, optical and other high-tech industries.

This moderate viscosity compound has good flow properties and can be cast in sections up to ½ inch thick. EP17HT-100 is not premixed and frozen and has an unlimited working life at room temperature. It is a reliable electrical insulator offering a volume resistivity of >1015 ohm-cm. This dimensionally stable system bonds well to metals, composites, ceramics, glass and many plastics. EP17HT-100 exhibits a tensile lap shear strength exceeding 2,700 psi at ambient temperatures after being post cured for several hours at 350-400°F.

EP17HT-100 has superior chemical resistance to oils, fuels, acids, bases, water and many solvents. It has a thermal conductivity of 4-5 BTU·in/(hr·ft²·°F) [0.58-0.72 W/(m·K)]. The service temperature range for this product is -100°F to +500°F. EP17HT-100 is naturally yellow-tan, but other colors are also offered. It is available for use in syringes, ½ pint, pint, quart and gallon containers.

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