The heart of advanced packaging is combining best-in-class components despite differing processes, nodes, materials, and sources. Heterogeneous 2.5D/3D ICs integrate elements that are manufactured with different processes; built at different technology nodes; made of different materials; or sourced from different vendors. This enables design engineers to craft extraordinary devices by incorporating best-in-class components, regardless of differences. NHanced is the only commercial provider to offer hybrid bonding of dissimilar materials.

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