Hybrid bonding permanently bonds the surfaces of two wafers, dies, and/or chiplets, combining two distinct types of bonds: a dielectric-to-dielectric covalent bond and a metal-to-metal fusion bond. The most commonly used process, DBI® (direct bond interconnect), was pioneered by Ziptronix in 2005 and is now owned by Adeia and licensed to NHanced. DBI hybrid bonding is today’s best technology for 2.5D and 3D advanced packaging. It creates a robust, seamless bond and enables extremely fine-grained interconnect.

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