Our Foundry 2.0 business model begins with wafers, dies, and chiplets sourced from traditional high-volume semiconductor foundries. These building blocks are combined, modified, and assembled using semiconductor fab processes. We provide heterogeneous integration for 3DICs and 2.5D interposer assemblies, including photonics and co-packaged optics. As a third-party integrator, we don’t build transistors, so we don’t compete with leading foundries – we work with them.

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