Advancing end to end optical infrastructure for next generation AI data centers at OFC 2026

TE Connectivity will exhibit a broad portfolio of integrated optical, copper and thermal innovations enabling scalable, high-performance AI architectures.

HARRISBURG, Pa. – March 16, 2026 – As AI workloads drive unprecedented demands for bandwidth, power efficiency and system density, co‑packaged optics (CPO) and co‑packaged copper (CPC) are emerging as critical enablers of next‑generation data center and AI cluster architectures, bringing optical and electrical interfaces closer to compute and switching silicon to reduce power, improve signal integrity and unlock scalable system-level performance.  

TE Connectivity, a world leader in connectors and sensors, will showcase its end-to-end solutions portfolio at OFC 2026 from March 17-19 in Los Angeles, California (South Hall, Booth 649). 

At this year’s OFC, TE will feature a breakthrough capability for high-density fiber array units (FAUs), enabled by the company’s recent acquisition of RAM Photonics. The technology is fundamentally differentiated due to its ability to create arrayed fiber connections utilizing advanced active alignment and automated optical fiber fusion splicing. This approach delivers industry leading density, manufacturing scalability, and lower insertion loss. 

“As the industry moves toward higher-speed, optics-driven architectures, our strength in go-to-market and global manufacturing scaling helps support our customers in addressing critical near-chip optical connectivity challenges,” said Pranav Garg, vice president of strategy, business development and incubation at TE Connectivity. “Our recent acquisition of RAM Photonics strengthens TE’s optics portfolio by adding foundational high-density FAU capabilities, reinforcing our long-term investment and commitment to optical innovation.” 

At OFC, TE will feature demonstrations that highlight its expanding optical portfolio for AI data centers, including:

• A CPC-to-CPO architecture, featuring 1.6T Linear Receive Optics (LRO) enabled by TE’s AdrenaLINE Catapult ultra-high-density connectors alongside 3.2T CPO integration.
• A CPO-to-optical backplane system, illustrating an end-to-end passive optical path across the rack, integrating CPO/NPO sockets, FAUs, External Laser Small Form Pluggable (ELSFP) connectivity, blind-mate optical connectors and a high-density optical backplane with front-panel connectivity and integrated liquid cooling.
• Additional demonstrations include 1.6T LRO high-speed cable assemblies, optical transceivers and FAU technology supporting next-generation optical interconnect architectures.

“Our presence at OFC 2026 underscores TE’s commitment to delivering end‑to‑end connectivity solutions that help customers scale with confidence,” said Mike Tryson, vice president and chief technology officer for TE Connectivity’s Digital Data Networks business unit. “By bringing together optical, copper and thermal innovations across the system, we’re helping enable customers to build more efficient, high‑performance architectures for the next generation of AI and high‑speed networks.” 

Further information on TE’s AI solutions can be found at te.com/AI 

About TE Connectivity

TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. As a trusted innovation partner, our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers enabling artificial intelligence, and more. Our more than 90,000 employees, including 10,000 engineers, work alongside customers in approximately 130 countries. In a world that is racing ahead, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Instagram.