Photon Bridge Demonstrates >30 mW Laser Output Per Color at Wafer Scale on Silicon Photonics
Photon Bridge validates cost-effective wafer-scale manufacturing for next-generation CPO architectures
Eindhoven, The Netherlands, February 18, 2026 - Photon Bridge, a photonics semiconductor disruptor, today announced wafer-scale validation of its heterogeneous photonics platform for multi-wavelength light engines. The company demonstrated single-channel output power exceeding 30 mW at the silicon chip edge facets in continuous-wave operation at room temperature. The demonstrated power levels meet per-channel requirements for next-generation 1.6T and 3.2T co-packaged optical engines, enabling reduced fiber count and improved rack-level energy efficiency.
While traditional non-muxed ELS solutions deliver one color per fiber with high power 250mW lasers, Photon Bridge’s platform achieves comparable aggregate per fiber output by combining multiple wavelengths on a single fiber. By integrating lasers and multiplexing on a single silicon photonics interposer, the platform reduces fiber count, simplifies assembly and improves thermal efficiency.
The milestone validates a fully integrated architecture in which lasers and wavelength filters reside on a single silicon photonic integrated circuit (PIC), eliminating discrete micro-optics and simplifying assembly. Leveraging established commercial III–V and 200 mm silicon photonics foundries, the platform enables scalable and cost-effective deployment in next-generation AI-driven CPO systems.
Unlike conventional III–V-on-silicon approaches that depend on tight manufacturing tolerances and complex test flows, Photon Bridge’s platform is designed for volume production. A simplified silicon photonics process and OSAT-compatible assembly reduce III–V laser integration time by up to 80×. Initial wafer-scale testing demonstrated robust III–V–silicon interface connectivity, with more than 92% of interconnections meeting performance specifications.
“Delivering more than 30 mW from a single integrated channel at wafer scale validates both the power handling and manufacturability of our platform,” said Paul Marchal. “The architecture scales to 8, 16, or 32 wavelengths per fiber and can extend across multiple fibers to achieve significantly higher aggregate output power, without driving individual lasers to extreme power densities. With scalability demonstrated, we are now focused on industrialization and customer qualification for high-volume deployment.”
The platform is designed to scale to quantum dot laser technology, offering the potential for isolator-free operation and further simplifying system-level design for high-density optical engines.
Connect with the Photon Bridge team at OFC Conference, booth 757, to explore how multi-wavelength light engines are redefining bandwidth scalability for AI and datacenter infrastructure.
About Photon Bridge
Photon Bridge is a Netherlands based photonics semiconductor disruptor. The company was founded to address the growing gap between compute performance and data throughput, where optical interconnects have become critical to sustaining AI growth.
Photon Bridge develops multi-wavelength digital light engines for DWDM data center optics, enabling the bandwidth scaling required for next-generation AI and high-performance computing infrastructure. By redefining photonic integration, the company makes light scalable, manufacturable, and infrastructure-ready.
Its patented cantilever waveguide platform unifies lasers, silicon photonics, and optical control into a single, production-ready architecture. Designed for compatibility with commercial foundries and OSAT assembly flows, the platform enables cost-effective, high-volume manufacturing of advanced photonic components.
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