SET - Smart Equipment Technology

St Jeoire, Haute-Savoie 74490


About SET - Smart Equipment Technology



131 Impasse Barteudet
St Jeoire, Haute-Savoie 74490

More Info on SET - Smart Equipment Technology

Manufactures assembly and packaging equipment. Portfolio includes die-to-die, die-to-wafer, flip chip bonders and nanoimprint lithography tools.


Buyer's Guide


ACCµRA family and especially OPTO are dedicated to R&D environment
Buyer's Guide

NPS300 Nano imPrinting Stepper for Hot Embossing and UV-NIL

NPS300 replicates micro or nanometer scale structures.
Buyer's Guide

LDP150 Large Device Bonding Press

LDP150 Large Device Press is especially designed for large components
Buyer's Guide

SET FC150 Automated Die/Flip Chip Bonder

Flexible High Accuracy FC150 for various flip-chip applications
Buyer's Guide

FC300 Submicron High Force Die / Flip Chip Bonder

FC300 fits to very high accuracy and high force bonding

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