• Disco

    13-11 Omar-kith 2 Chome
    Ota-ku, Tokyo 143-8580
    Japan
    81-3-4590-1100
    81-3-4590-1188
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    More Info on Disco

    Manufactures precision machinery and diamond products.

    Articles

    A wafer after separation.
    A newly developed laser wafer slicing method achieves high-speed production of silicon carbide (SiC) wafers.

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