• Microelectronic Packaging Dresden GmbH

    Grenzstr 22
    Dresden 01109
    Germany
    49-351-21-36-100
    49-351-21-36-109
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    More Info on Microelectronic Packaging Dresden GmbH

    Offers development and mass production of customer-specific microelectronic packaging solutions such as MCM, COB, BGA, and CSP applications on several substrate materials.

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