my-Chip Production GmbH

Prof-Hermann-Klare-Str 6
Rudolstadt D-07407
Germany
49-3672-4782-60
49-3672-4782-65
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Provides service contracting for slicing and grinding wafers of brittle material including sapphire, Si, SiC, GaAa, GaN, GaP, InP, glass, quartz, piezo, and others.

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