Centerline Technologies

577 Main St Suite 270
Hudson, MA 01749-3096
United States
978-568-1330
978-568-1334
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More Info on Centerline Technologies

Offers precision lapping, polishing, laser machining, diamond sawing, edge/diamond machining, tumbling, and a filled via planarity process. Materials: Alumina (99.6% and 96%), AlN, BeO, Fused Silica/Quartz/Glass, Sapphire, Lithium Niobate, Titinates.

Products

Lapped Titanates 15-30 u-in +/- .0005". Polished Titanates < 3 u-in +/- .0005" for RF & Microwave devices requiring high Q performance.
Lapped Fused Silica 10 u-in nominal matte finish +/- .0005". Polished Fused Silica < .1 u-in +/- .0005". Used for Optical or High Frequency interconnects requiring extremely low...
Polished 99.5% Beryllium Oxide < 3 u-in +/- .0005". Lapped 99.5% Beryllium Oxide 20-30 u-in +/- .0005". Used for high power DC/RF/Microwave circuits.
Polished Aluminum Nitride < 2 u-in +/- .0005". Used for higher power DC/RF/Microwave & Optical applications. Lapped Aluminum Nitride 12 u-in nominal +/- .0005". Used for higher...
Centerline Technologies capabilities include lapping, polishing, laser machining, diamond sawing, edge/diamond machining, tumbling and a filled via planarity process. Materials...

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