November 8, 2004, Irvine, CA--Expanding its packaging line-up for optoelectronic products, Toshiba America Electronic Components (TAEC) has introduced a compact, high-speed, surface-mount MOSFET/IGBT gate driver photocoupler. The Toshiba TLP701 is housed in a new SDIP package that occupies half the space of standard 8-pin DIP devices and, according to the company, is the smallest opto-isolator package currently available that is designed to comply with reinforced insulation class international safety standards.
The TLP701 photocoupler comprises a gallium aluminum arsenide (GaAlAs) light-emitting diode (LED) and an integrated photodetector. To achieve its small size, Toshiba engineers redesigned the internal construction and packaged the LED and IC driver in the new, compact SDIP package. According to the company, it is ideal for power MOSFET and IGBT gate drivers that can be used in inverter circuits for home appliances and industrial motors where space considerations are important. Applications include plasma flat-panel displays, air conditioners, uninterruptible power supplies, and other inverter-based equipment.
"While considerations of real-estate size, performance and application flexibility are paramount in achieving next generation electronic products, these devices must also meet appropriate safety certifications," said Yoshimichi Sasaki, business development director at TAEC for the optoelectronics business unit. "This new photocoupler addresses all of these important design criteria."
The Toshiba TLP701 is available now, priced at $0.90 each in sample quantities.
