3DIcon to acquire Dimension Technologies

July 24, 2012
Tulsa, OK, and Rochester, NY--3D display technology developer 3DIcon (OTCBB:TDCP) and Dimension Technologies, which develops next-generation flat-screen 3D displays, have signed a non-binding letter of intent outlining the terms and conditions for 3DIcon to acquire Dimension Technologies.

Tulsa, OK, and Rochester, NY--3D display technology developer 3DIcon (OTCBB:TDCP) and Dimension Technologies, which develops next-generation flat-screen 3D displays, have signed a non-binding letter of intent outlining the terms and conditions for 3DIcon to acquire Dimension Technologies.

Dimension Technologies' technologies, patent portfolio, and innovation capabilities will complement 3DIcon's glasses-free flat-screen 3D display technologies, says Mark Willner, 3DIcon's CEO.

"Being part of 3DIcon will enable us to get products that incorporate our technology to market much faster by leveraging the existing display industry relationships and commercialization expertise of the 3DIcon management team," says Arnie Lagergren, Dimension Technologies' CEO. "In addition, being part of a public company gives us much more efficient access to capital. Both of these will allow us to focus on developing higher performance and lower cost flat-screen 3D display technologies that are already on our technology roadmap."

The letter of intent is not binding on either company and there is no assurance that the companies will reach a definitive agreement.

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