Disco

13-11 Omar-kith 2 Chome
Ota-ku, Tokyo 143-8580
Japan
81-3-4590-1100
81-3-4590-1188
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More Info on Disco

Manufactures precision machinery and diamond products.

Articles

A wafer after separation.
A newly developed laser wafer slicing method achieves high-speed production of silicon carbide (SiC) wafers.

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