SET - Smart Equipment Technology

131 Impasse Barteudet
St Jeoire, Haute-Savoie 74490
France
33-4-50-35-83-92
33-4-50-35-88-01
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More Info on SET - Smart Equipment Technology

Manufactures assembly and packaging equipment. Portfolio includes die-to-die, die-to-wafer, flip chip bonders and nanoimprint lithography tools.

Products

ACCµRA family and especially OPTO are dedicated to R&D environment
NPS300 replicates micro or nanometer scale structures.
LDP150 Large Device Press is especially designed for large components
Flexible High Accuracy FC150 for various flip-chip applications
FC300 fits to very high accuracy and high force bonding

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