• SET - Smart Equipment Technology

    131 Impasse Barteudet
    St Jeoire, Haute-Savoie 74490
    France
    33-4-50-35-83-92
    33-4-50-35-88-01
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    More Info on SET - Smart Equipment Technology

    Manufactures assembly and packaging equipment. Portfolio includes die-to-die, die-to-wafer, flip chip bonders and nanoimprint lithography tools.

    Products

    ACCµRA family and especially OPTO are dedicated to R&D environment
    NPS300 replicates micro or nanometer scale structures.
    LDP150 Large Device Press is especially designed for large components
    Flexible High Accuracy FC150 for various flip-chip applications
    FC300 fits to very high accuracy and high force bonding

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