Finetech

544 W Iron Ave Suite 102
Mesa, AZ 85210
United States
480-893-1630
Visit Company Website

More Info on Finetech

Supplier of equipment for bonding, packaging and assembly of photonic and optoelectronic devices. Versatile bonders provide sub-micron placement, repeatability, superior optics, process flexibility. Models for R&D to production.

Products

Sub-micron die-bonder for precision die attach and advanced chip packaging.

Finetech Categories

Buyer’s Guide Listing Information

Click here for listing information and directions on how to add or update your company.

Request More Information From Finetech

By clicking above, I agree to Endeavor Business Media's Terms of Service and consent to receive promotional communications from Endeavor, its affiliates, and partners per its Privacy Notice. I also understand my personal information will be shared with the sponsor of this content, who may contact me about their offerings per their privacy policy. I can unsubscribe anytime.